芯片冷却新型集成热管散热器的实验研究

An experimental study of a novel integrated heat pipe-heat sink for chip cooling

为提高热管散热器在芯片冷却中的换热性能,设计了一款新型集成热管散热器,其冷凝器外侧翅片的散热面积高达0.38 m2,并对该散热器进行了时间响应特性、压降特性和换热特性的实验研究.实验结果表明:该款集成热管散热器具有高效的换热性能,当空气流速为2.93 m/s和最大温差限制在50℃时,加热功率可以达到423 W,相应的热阻仅0.118 K/W,对应的空气压降仅有30 Pa.

To increase thermal performance of a heat pipe-heat sink for chip cooling, a novel integrated heat pipe-heat sink is presented, whose condenser＇s fins outside cooling surface is about 0.38 m^2. The time response, pressure drop and heat transfer characteristics of the integrated heat pipe-heat sink were investigated by experiment. Results show that the integrated heat pipe-heat sink has high-effective heat transfer performance. With the airflow velocity 2.93 m/s and maximum temperature difference restrict 50 ℃, the heat sink can dissipate 423 W and the corresponding thermal resistance is only 0. 118 K/W, while the pressure drop through the heat sink is just 30 Pa.