蜂窝夹芯板缺陷的ESSPI无损检测

ESSPI non-destructive testing of honeycomb sandwich panel for bonding defects

蜂窝夹芯板的缺陷严重地制约和影响了其在航空航天领域的应用.介绍了电子剪切散斑干涉技术的基本原理,并利用电子剪切散斑干涉技术,用热加载的方式对蜂窝夹芯板进行了无损检测,通过图像处理及对含缺陷材料的3点弯曲实验,验证了电子剪切散斑干涉技术的正确性和适用性.结果表明,蒙皮与蜂窝芯子的脱粘等缺陷是蜂窝夹芯板强度降低的主要原因,该无损检测技术可以快速地对蜂窝夹芯板的质量检测进行评估.

Bonding defects of the honeycomb sandwich panel reduced its strength greatly, thus the application in aeronautics and astronavigation was influenced seriously. The basic principles of electronic speckle shearing pattern interferometry （ESSPI） were introduced. Using ESSPI technique and thermal loading meth- od, non-destructive testing to honeycomb sandwich panels was conducted, then image processing was carried through compiled program. The validity and practicability of ESSPI technique was proved through the threepoint bending experiment. The results show that the main reason of strength decrease is the defects of facesheet and honeycomb core debonding, and the ESSPI is very effective evaluation technique to the honeycomb sandwich panel quality.