高导热型铝基覆铜板研究

Highly thermal conductive copper-clad aluminum substrate

为研究一种高导热铝基覆铜板,以合成的双马改性环氧树脂为基体,最佳质量配比的氮化铝、氮化硅、氮化硼等混合粒子为导热填料制备了绝缘导热胶粘剂,并以此导热胶成功制备了高导热铝基覆铜板.分析了树脂配方设计,探讨了填料含量对绝缘层导热、耐高温、电绝缘及粘接强度的影响.研究表明,研制的基板热导率达1.38 W/(m.K),热阻0.65℃/W,体、表电阻率分别为3.2×1014Ω.cm及4.6×1013Ω,可长期在160℃下使用,剥离强度13 N/cm,与低导热基板相比具有良好的传热能力.

A kind of insulating thermal conductive adhesive （ITCA） was prepared by using the bismaleimidemodified epoxy resin synthesized in our lab as the matrix, and the mixture of AIN, Si3N4 and BN particles at optimal mass ratio as the heat conductive filler. Then, a novel highly thermal conductive copper-clad aluminum substrate （TCCAS） was successfully developed based on the prepared ITCA, copper foil and aluminum substrate through hot press technology. Investigation on the formulation design and the effects of fillers concentration on various physical properties of the TCCAS indicates that the thermal conductivity, thermal resistance, volume and surface resistivity and peel strength are 1.38 W/（m·K）, 0. 65 ℃/W, 3.2 ×10^14~Ωcm, 4.6 ×10^13Ωand 13 N/cm, respectively, together with the long term use at 160 ℃. It is proved that the obtained TCCAS has better heat conduction property compared with the non-thermal conductive counterpart.