通过微观形态控制降低导电高分子复合材料逾渗值的研究进展

Progress in the Study of the Percolation Threshold Reduction for Conductive Polymer Composite by Micromorphology Controlling

降低复合型导电高分子材料的逾渗值是实现材料低成本化和高性能化的关键。这方面的研究一直以来都受到学术界和产业界的广泛关注。本文介绍了近年来通过微观形态控制手段降低导电高分子复合材料逾渗值的研究状况。文章将现有的形态控制方法归纳为双逾渗方法、隔离分布方法、原位微纤方法、自组装方法等七大类,并从微观形态实现机理、形态与电性能关系、应用前景等方面对这些方法进行了讨论。此外,本文还对该研究领域未来发展趋势作了展望。

Reduction of percolation threshold for the filled conductive polymer composite is the key factor for realization the cost minimization and the performance enhancing of the materials. The researches about this area have received extensive attention for both academic and industry circles for a long time. In this paper, the progress in the study of the percolation threshold reduction by micromorphology controlling is introduced. The current morphology controlling methods is divided into seven types including double percolation, segregated distribution, in-situ microfibrillar method, self-assembled method, and so on. Those methods are discussed comprehensively based on the mechanism of micromorphology realization, the relationship between morphology and electronic properties, and the application prospect, and so no. In addition, the development trend of this research area is provided.