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高速跨阻放大器设计综述 被引量：4

Overview on Design of the High-Speed Transimpedance Amplifier
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摘要 介绍了高速光纤系统中超宽带跨阻型前置放大器所采用的工艺以及最新研究进展。利用仿真技术对高速跨阻放大器设计中常采用的各种高性能技术包括峰化技术和匹配网络技术进行了详细的对比分析。最后总结了目前流行的基于CMOS工艺设计的高速跨阻放大器电路结构并展望了高速跨阻放大器的发展趋势。 The technologies and the latest progress of Ultra-Wideband transimpedance amplify（TIA） in high-speed optical system were introduced. Compared with the high-performance technologies of high- speed TIA, including peaking technology and matching network technology by simulation thchnique. Finally, this paper summarizes some popular configurations of TIA based on CMOS technology in recent years and the prospect of high-speed transimpedance amplifier.
作者 赵萌 李雪 韩波 高建军
机构地区 华东师范大学信息科学技术学院
出处 《电子器件》 CAS 2009年第3期570-573,共4页 Chinese Journal of Electron Devices
关键词 高速电路 跨阻放大器 仿真技术 光接收机 匹配技术 high-speed circuit transimpedance amplify simulation technique optical receiver matching technology
分类号 TN43 [电子电信—微电子学与固体电子学] TN722 [电子电信—电路与系统]
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参考文献21

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二级参考文献4

同被引文献35

  • 1黄茜,冯军.10Gb/s 0.18μmCMOS光接收机前置放大器[J].电子器件,2006,29(1):29-32. 被引量：4
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  • 7KimJ, BuckwalterJ F. Bandwidth enhancement with low group-delay variation for a 40-Gb/ s trans impedance amplifier[J]. IEEE Trans. on Circuits and Systems I: Regular Papers, 2010, 57(8): 1964- 1972.
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  • 10Analui B, Hajimiri A. Bandwidth enhancement for trans impedance amplifiers[J]. IEE[J. Solid-State Circuits, 2004, 39(8): 1263-1270.

引证文献4

二级引证文献5

电子器件
2009年 第3期

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