电力电子设备常用散热方式的散热能力分析

Heat Dissipation Ability of General Cooling Technology for Electronic System

本文对电力电子设备中常用的风冷和水冷两种散热方式的散热能力作了综合分析。分析结果表明,以散热器底面热源的均匀热流大小作为散热能力的标准,在保证电子设备正常工作的条件下,有散热空间限制时,风冷系统散热极限约为40W/cm^2,如果不受散热空间的限制,散热能力会更高。水冷系统的散热能力比风冷系统高出1到2个数量级,其散热潜力还未得到充分挖掘,目前水在微通道内强制对流的冷却方式是水冷系统中具有最大散热能力的方式,其散热能力可达790W/cm^2。这两种冷却方式散热能力的分析结果可作为热设计人员选择经济合理的散热方式的依据。

This paper analyzes heat dissipation abilities of air-cooling and water-cooling technologies used in electronic system. The analysis results show that the heat dissipation limit for air-cooling is about 40W/cm2 within a restricted dissipation space. If the dissipation space is not restrained, the heat dissipation ability may be higher. The heat dissipation ability of water-cooling technology is about one or two orders of magnitude higher than that of air-cooling. Now the heat dissipation limit of water-cooling hasn＇t been found out. The heat dissipation ability of micro-channel heat exchanger is the biggest among that of water-cooling system. It can reach to 790W/cm2.