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退火温度对WO_3薄膜结构及气敏性能的影响 被引量:1

Effect of annealing temperature on structure and gas-sensing properties of WO_3 thin films
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摘要 采用直流磁控溅射法制备了WO3薄膜,并在350—550℃时对薄膜进行退火处理,研究了退火温度对薄膜结构及气敏性能的影响。结果表明:退火前及350℃退火后的薄膜为非晶态,450℃和550℃退火后的薄膜为WO3-x型晶态;随退火温度的提高,薄膜厚度增加,晶粒度增大。550℃退火后薄膜的厚度,较450℃退火后薄膜厚30nm,晶粒度相差8nm;450℃和550℃退火后的薄膜,在150℃时对体积分数为0.05%的NO2的灵敏度接近于22。 WO3 thin films were deposited onto glass substrates by DC magnetron sputtering technology and then it was annealed at 350- 550℃. Effects of annealing temperature on the structure and gas-sensing properties of the thin films were studied. The results show that as-deposited thin films and thin films annealed at 350 ℃ are amorphous, the thin films annealed at 450℃ and 550℃ are WO3_x crystaIs. As the annealing temperature increases, the crystallite and the thin film thickness increase simultaneously. The thickness of thin films annealed at 550℃ is thicker than that of the thin films annealed at 450℃ by 30 nm and the crystallite is bigger by 8 nm. The sensitivity of thin films annealed at 450 ℃ and 550 ℃ to 0.05% (volume fraction) NO2 is about 22 at working temperature of 150℃.
出处 《电子元件与材料》 CAS CSCD 北大核心 2009年第8期50-52,65,共4页 Electronic Components And Materials
基金 重庆市教育委员会科学技术研究资助项目(No.KJ070804)
关键词 WO3薄膜 退火 晶体结构 气敏性能 WO3 thin film annealing crystal structure gas-sensing property
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