摘要
将铜导电胶进行热老化、自然老化、耐水等试验，以研究其老化性能，并探求改善铜胶抗老化性能的途径。结果表明：铜胶的抗老化性能好，其主要影响因素是树脂与铜粉用量之比。
Heat ageing, natural ageing and water tolerance etc. tests are carried out to study and improve the ageing resistance of copper conductive adhesive. The result shows that the ageing resistance of copper conductive adhesive is good and the major influential factor is the weight percent of resins to copper powder.
出处
《材料科学与工程》
CSCD
1998年第2期59-60,80,共3页
Materials Science and Engineering
