高性能嵌入式处理器技术

High Performance Embedded Processor Technique

介绍面向分布式集群计算机的高性能嵌入式处理器产业链,分析该产业链中CPU核提供商、处理器芯片开发商、系统软件提供商、嵌入式计算机制造商等各个环节的技术特点,并在高性能嵌入式处理器开发上做了有益的探索。提出要积极与系统软件、嵌入式计算机制造商协作,充分发挥软硬件协同设计能力,以开发出面向分布式集群计算机的高性能嵌入式处理器。进一步指出多核设计与高速总线电路是高性能嵌入式处理器发展的未来之路。

This paper introduces the industrial chain of high performance embedded processor used in distributed cluster computer and analyzes the technical feature of the each node in the chain, such as the vendor of CPU core, processor developer, the vendor of system software, the producer of embedded computer. It explores the development of high performance embedded processor and gains some experience. It suggests to cooperate with the vendor of system software and the producer of embedded computer and exerts the ability of software and hardware co-design to develop the high performance embedded processor. It predicts that the technique of multi-core and high speed bus circuit is the road to future.