密封继电器弹簧片压力的激光校正研究

Pressure adjustment of hermetically sealed relay spring by laser-forming

针对某型号密封继电器弹簧片压力的精确校正难题,应用激光技术进行金属非接触校正的研究,并进行了相关的测试试验.试验结果表明:激光校正方法用于弹簧片压力的精确校正是可行的,但发射激光束的总能量E不能超过0.3 J,否则,激光束会将弹簧片击穿.当激光能量E一定时,设定的激光功率P越大、,照射时间t越短,弹簧片获得的压力校正值Δp则越大,且Δp的大小还与激光照射在弹簧片上的位置有关.在P=80 W、t=3 ms试验条件下,当压力测量点与激光照射点之间的距离x<a(mm)时,Δp≤2 mN;当x≥a时,压力的校正值突然阶跃增大,此时5 mN≤Δp≤12 mN.

To precisely adjust the pressure of hermetically sealed relay spring, the pressure adjustment of spring by laser forming was performed. The relative test and measurement were conducted. Results show that it is feasible to realize the precise pressure adjustment of relay spring by laser-forming, while the energy of laser beam can not be higher than 0. 3 J; As the laser energy is constant, the change quantum Ap of the pressure is increased with the increasing laser power P and the decreasing time tof laser-beam irradiation on the surface of spring. The Ap is also in proportion to the distance x between measuring point and adjusting point. When P = 80 W, t = 3 ms, andx 〈 a （mm）, then △p ≤ 2 mN; whenP = 80 W, t = 3 ms, andx ≥ a （mm）, then 5≤ △p ≤ 12 mN, it means that the Ap stepping inereases suddenly.