摘要
拆卸电路板上元器件所用的加热方法有热风加热、红外线加热、液体加热和激光加热。文章利用TOPSIS法比较了这几种加热方法,建立了指标评价体系和评价模型,运用三标度法确定评价指标权重,最后对这几种方案进行优先排序,结果为:液体加热>红外线加热>激光加热>空气加热。
In order to disassemble components on PCBs, four methods of heating PCBs are introduced, including the hot-air way, the infrared way,the hot-liquid way, and the laser way. This paper adopts the TOPSIS method to compare these different ways. An evaluation index system and an evaluation model are set up. The three-scale method is used to decide the indicators＇ weight. A priority order of the four methods is given as follows： hot-liquid〉infrared〉 laser〉 hot-air.
出处
《合肥工业大学学报（自然科学版）》
CAS
CSCD
北大核心
2009年第7期950-954,共5页
Journal of Hefei University of Technology：Natural Science
基金
国家科技支撑计划子课题资助项目(2006BAF02A17)
关键词
电路板
指标评价体系
TOPSIS法
三标度法
printed circuit board（PCB）
evaluation index system
TOPSIS method
three-scale method
