摘要
固晶胶的粘接可靠性是制约其在SMTLED(表面贴装发光二极管)封装应用中的主要影响因素。分析了与固晶胶相关的SMTLED不良现象,讨论了引发SMT失效的固晶胶的氧化腐蚀、裂缝和分层、蠕变以及工艺缺陷等主要粘接失效机理,提出了提高SMT粘接可靠性的建议。
The influence of bonding reliabihty for die attach adhesives（DAA） is main factor on application of DAA in encapsulation SMT LED. The bonding failure of DAA in SMT LED were analysed,and main bonding failure mechanisms such as oxidation/corrosion,crack and delamination,creep,technology defects were discussed for DAA which could induce SMT bonding failure. The advise for enhancing bonding reliability of SMT was puted forward.
出处
《中国胶粘剂》
CAS
北大核心
2009年第7期59-63,共5页
China Adhesives
关键词
固晶
胶粘剂
SMT
封装
失效机理
可靠性
评价
die attach
adhesive
SMT
encapsulation
failure mechanism
reliability
valuation
