化学镀法制备Cu/Al_2O_3复合粉体及其烧结行为

Preparation and Sintering Behavior of Cu-Al_2O_3 Nano-composite Powders by Electroless Copper Plating

为了解决颗粒增强铜基复合材料中颗粒与铜基体相容性的问题,采用化学镀法使得颗粒表面金属化,通过XRD、SEM、EDS等技术研究了Al2O3纳米粉化学镀铜的工艺,并对Cu/Al2O3复合粉体的烧结行为做了初步探讨。结果表明:Al2O3粉前处理工艺、镀液的各种成分都对粉体表面铜的含量有影响,通过改变装载量可有效控制粉体表面Cu含量。实验中确定了最佳的镀覆工艺,并得到了颗粒较为弥散的Cu/Al2O3复合粉体烧结体。

In order to solve the problem of consistence between particles and particle-reinforced copper-based composite, electroless plating was used to make the particle surface metallization. The technology of electroless copper plating on the surface of nano-Al2O3 was studied and the sintering behavior of Cu/Al2O3 nano-composite powders was discussed by XRD, SEM, EDS, etc. The results show that Al2O3 powder pre-treatment process and the various components of bath have effects on the Cu content of the surface of powder. The Cu content of the surface of powders is effectively controlled by hanging the load of raw powder. The best plating process was determined and the sintering of Cu/Al2O3 nano-composite powders which had distribution of particle dispersion was obtained.