摘要
伴随高密度电子组装技术的发展,BGA元件成为高密度、高性能、多功能及高I/O数封装的最佳选择,并已经得到广泛应用。介绍了BGA元件的分类、焊盘设计、组装工艺、焊点检测技术及返修工艺。
BGA component is the best choice for higher density and performance, more function and lJO, and is becoming more widely used with the development of higher density assembly. The paper introduces mainly the kinds, pad design, assembly process, inspection technology of solder jiont and rework of BGA component.
出处
《电子工业专用设备》
2009年第7期7-16,共10页
Equipment for Electronic Products Manufacturing
关键词
球栅阵列封装
焊盘设计
组装工艺
质量控制
检测技术
返修
Ball Grid Assembly （BGA） Package
Pad Design
Assembly Process
Quaility Control
Inspection Technology
Rework
