电子器件用复合热管散热器的试验研究

Experimental Study on Indirect Thermosyphon Radiator Coupled with Flat Heat Pipe for Electronic Component

结合间接热虹吸管和扁平热管的特点，研制出一种新型电子器件用复合热管散热器，并试验分析了该散热器分别使用甲醇、乙醇、丙酮、水和R123等工质的散热性能以及充灌率和风速等设计因素对其散热性能的影响。试验结果表明：该复合型散热器在较宽广的热流量范围内和较大热流量的情况下均具有良好的性能，小符热流姑突变还足稳定，该复合型热管散热器都可以使电子器件表面温度保持平稳，小出现大幅度波动；工质为R123时的散热效果最好，当热流量为200W时，可以保证电子元件表面温度低于70℃。电子器件常用的热流量范围即在100～140W内，散热器适宜的充灌率约为80％。

To improve the performance of the radiator for electronic component, the indirect thermosyphon radiator coupled with fiat heat pipe is developed. The characteristics of this compound radiator charged with methanol, ethanol, acetone, water and R123, respectively, are experimented, and the influences of charging rate and wind velocity on the radiating effect are discussed. The results demonstrate that the compound radiator owns favorable performances under wide range of radiation power, especially in heavy duty, and it is able to keep the temperature in junction layer die steady whether the radiating power varies smoothly or suddenly. The radiator charged with R123 can attain better performances and keep the temperature in junction layer less than 700C when the radiating power is even as high as 200W. The optimum charge rate of the radiator is about 80% when the radiating power varies from 100W to 140W.