金丝球焊机金丝检测技术

Monitoring Technology for Wire Bonding in Automatic Gold Wire Ball Bonder

在应用于三极管压焊的全自动金丝球焊机中,金丝检测是确保压焊过程工艺质量的关键技术。通过设计金丝的打火失球检测和第一焊点、第二焊点压焊失败检测电路,实现金丝球焊机的金丝压焊效果自动检测功能。实验证明,所设计的检测电路完全满足压焊工艺质量的要求。

In the automatic gold wire ball bonder for the transistor packaging, the gold bond wire test is the key technology to ensure the process quality of the wire bonding. In this research, a circuit is designed for monitoring the deformed free-air ball and the failure of the first bond or the second bond to realize the automatic bonding monitoring in the gold wire bali bonder. The experiment results show that the monitoring circuit can satisfy the quality requirements of the bonding process.