期刊文献+

Mechanical and electrical properties of In-Bi solder at Bi_(2212) superconductor interface with annealed Ag spray layers and Ag precoating layers

Mechanical and electrical properties of In-Bi solder at Bi_(2212) superconductor interface with annealed Ag spray layers and Ag precoating layers
下载PDF
导出
摘要 The electrical properties of solder contact layers between Cu-Ni shunt metal and tube type Bi2212 superconductor that is applied in superconducting fault current limiter were studied.The contact properties of the solders are improved not only by Ag precoating layers,but also by the pre-sprayed Ag layer and subsequent Ag precoating layers.The annealed Ag sprayed layers onto Bi2212 superconductor prior to Ag electroplating work as protecting layers for the superconductor from plating solutions.The contact angle of the electroplated Ag layer is 42.91° and decreases to 15.25° and 5.88° with Ag sprayed layer and additional Ag electroplated layers.The Ag sprayed layer with suitable annealing prior to Ag electroplating improves contact strength of the Ag electroplated layer by about 12% due to denser microstructure of the Ag electroplated layers. The electrical properties of solder contact layers between Cu-Ni shunt metal and tube type Bi2212 superconductor that is applied in superconducting fault current limiter were studied. The contact properties of the solders are improved not only by Ag precoating layers, but also by the pre-sprayed Ag layer and subsequent Ag precoating layers. The annealed Ag sprayed layers onto Bi2212 superconductor prior to Ag electroplating work as protecting layers for the superconductor from plating solutions. The contact angle of the electroplated Ag layer is 42.91° and decreases to 15.25° and 5.88° with Ag sprayed layer and additional Ag electroplated layers. The Ag sprayed layer with suitable annealing prior to Ag electroplating improves contact strength of the Ag electroplated layer by about 12% due to denser microstructure of the Ag electroplated layers.
出处 《中国有色金属学会会刊:英文版》 EI CSCD 2009年第4期961-964,共4页 Transactions of Nonferrous Metals Society of China
关键词 超导故障限流器 Bi2212 电镀银 电气性能 喷涂层 预涂层 退火 焊料 SFCL Bi2212 Ag electroplating Ag spray process
  • 相关文献

参考文献15

  • 1OH S Y,KIM H R,JEONG Y H,HYUN O B,KIM C J.Effects of heat-treatment on critical current of BSCCO-2212 superconductor[J].Physica C,2007,463/465:464-467.
  • 2CHEN M,PAUL W,LAKNER M,DONZEL L,HOIDIS M,UNTERNAEHRER P,WEDER R,MENDIK M.6.4 MVA resitive fault current limiter based on Bi-2212 superconductor[J].Physica C,2002,372:1657-1663.
  • 3HODGE J D,MULLER H,APPLEGATE D S,HUANG Q.A resistive fault current limiter based on high temperature superconductors[J].Applied Superconductivity,1995,3:469-482.
  • 4LEE H Y.Lead-free solder alloys[J].J Korean Int Surf Eng,2002,35:218-231.
  • 5LEE C C,CHOE S.Fluxless In-Sn bonding process at 140 ℃[J].Materials Science and Engineering A,2002,333:45-50.
  • 6CHUANG R W,LEE C C.High-temperature non-eutectic indium-tin joints fabricated by a fluxless process[J].Thin Solid Films,2002,414:175-179.
  • 7YAMAMOTO N,IMAIZUMI T,SAWA K,TOMITA M,MURAKAMI M,HIRABAYASHI I.Contact characteristics for bulk superconductors[J].Physica C,2004,412/414:662-667.
  • 8CHANG T C,HSU Y T,HON M,WANG M C.Enhancement of the wettability and solder joint reliability at the Sn-9Zn-0.5Ag lead-free solder alloy-Cu interface by Ag precoating[J].J Alloys and Compounds,2003,360:217-224.
  • 9UELTZEN M,MARTINEK I,SYROWATKA F,FLOEGEL-DELOR U,RIEDEL T.Soldered Ohmic contacts to superconductors for high-current applications[J].Physica C,2002,372/376:1653-1656.
  • 10JANG J H,KIM S H,SHIN S Y,LEE Y C,KIM C J,HYUN O B,PARK H W.Influence of Ag precoating of Bi2212 superconductor-In base solder soldering[J].J Kor Inst Surf Eng,2006,39:57-63.

二级参考文献1

共引文献5

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部