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Characterization of flexible copper laminates fabricated by Cu electro-plating process 被引量:2

Characterization of flexible copper laminates fabricated by Cu electro-plating process
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摘要 Flexible copper clad laminates(FCCLs) were fabricated using the electro-plating process and the combined effect of the current density and plating time on their surface morphology,texture,hardness,electrical resistivity and folding behavior was evaluated.To achieve Cu layers with similar thicknesses,the current density was varied in the range of 0.2-3 A/dm2 and the plating time was controlled in the range of 0.5-7.5 h to compensate for the variation of the current density.The surface morphology,hardness,and folding behavior were characterized by atomic force microscopy,nanoindentation technique and Massachusett Institute of Technology folding endurance test,respectively.The X-ray diffraction patterns indicated that the Cu phase was formed without any secondary phases;however,the preferred orientation changed from(220) to(111) as the current density increased over 1 A/dm2.In addition,it was observed that the root-mean-square and hardness values decreased when the current density increased and the plating time decreased simultaneously.The electrical resistivity was as low as approximately 21 nΩ·m and the number of cycles without failure in the folding test was over 15 000,which were comparable to those of commercial FCCLs. Flexible copper clad laminates(FCCLs) were fabricated using the electro-plating process and the combined effect of the current density and plating time on their surface morphology, texture, hardness, electrical resistivity and folding behavior was evaluated. To achieve Cu layers with similar thicknesses, the current density was varied in the range of 0.2-3 A/dm^2 and the plating time was controlled in the range of 0.5- 7.5 h to compensate for the variation of the current density. The surface morphology, hardness, and folding behavior were characterized by atomic force microscopy, nanoindentation technique and Massachusett Institute of Technology folding endurance test, respectively. The X-ray diffraction patterns indicated that the Cu phase was formed without any secondary phases; however, the preferred orientation changed from (220) to (111) as the current density increased over 1 A/dm^2. In addition, it was observed that the root-mean-square and hardness values decreased when the current density increased and the plating time decreased simultaneously. The electrical resistivity was as low as approximately 21 nΩ·m and the number of cycles without failure in the folding test was over 15 000, which were comparable to those of commercial FCCLs.
出处 《中国有色金属学会会刊:英文版》 EI CSCD 2009年第4期965-969,共5页 Transactions of Nonferrous Metals Society of China
基金 supported by Grant No.RTI04-03-04 from the Regional Technology Innovation Program of the Ministry of Commerce,Industry and Energy (MOCIE),Korea
关键词 电镀工艺 层压板 铜层 制备 表征 电流密度 原子力显微镜 纳米压痕技术 electro-plating current density Faraday's law FCCL microstructure
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