焦磷酸盐体系电镀Ni_(70)Cu_(30)合金工艺

Electroplating of Ni_(70)Cu_(30) alloy from pyrophosphate bath

为了得到Ni70Cu加合金镀层，研究了镀液中主盐浓度比、配位荆浓度、温度、pH、电流密度等工艺参数对合金镀层成分、外观等的影响，并考察了多种添加荆对镀层性能的影响。确定了最优镀液组成及工艺条件为：七水合硫酸镍70g／L，五水合硫酸铜10g／L，三水合焦磷酸钾242g／L，硼砂38g／L，二乙二醇3mL／L，温度55℃，pH8．7，电流密度4～9A／dm^2。

To obtain a Ni70CU30 alloy deposit, the effects of the concentration ratio of main salts, concentration of complexing agent, temperature, pH and current density on the composition and appearance of deposit were studied. The effects of some additives on deposit performance were discussed. The optimal bath composition and process conditions are as follows： NiSO4.7H2O 70 g/L, CuSO45H2O 10 g/L, K4P2O73H2O 242 g/L, borax 38 g/L, diethylene glycol 3 mL/L, temperature 55 ℃, pH 8.7, and current density 4-9 A/dm^2.