SiC工件ELID磨削性能

ELID Grinding Performance of SiC

通过ELID(在线修整砂轮)磨削方法对SiC进行磨削试验,从材料去除机理、砂轮粒度的选择、切削深度等方面探讨了SiCELID磨削参数的选择。实验表明:砂轮粒度、切削深度对加工质量影响较大,在磨削效率和加工工件的表面质量等因素的综合分析基础上,找到优化的工艺参数,使效率和精度达到最高。在本试验条件下,用粒度为W3.5的金刚石砂轮磨削20min,表面粗糙度可达到0.023μm。

SiC is very hard and crisp and it is difficult to accurately machine SiC components. Through the electrolytic in-process dress（ELID） grinding experiment, selection of experiment parameters for grinding was analyzed and discussed in the aspects of the material removal mechanism, the cutting depth and single abrasive grain. The results indicated that single abrasive grain and the cutting depth affected the surface roughness. Based on analysis about surface finish and efficiency, the processing parameter was optimized. In the experiment, surface finish reached 0. 023 μm by using diamond grinding wheel of W3.5 during 20 min.