摘要
键合工序是半导体器件生产中的关键工序,采用统计过程控制(SPC)技术对关键工序进行监控是保持生产线稳定、减少质量波动的有力工具,可以提高产品的成品率和可靠性。在现有工序状态下采集键合拉力数据,计算和分析键合工序的工序能力指数,进行工艺调整和改进,直到工序能力指数Cpk≥1.33。选择计量控制图,对键合拉力数值进行监控,发现工序失控时,分析原因并及时采取纠正预防措施,保证工艺的一致性和稳定性,提高工艺成品率。
Wire bonding is a key process in semiconductor manufacture process, adopting statistic process control （SPC） technology to monitor the key process, it is a useful tool to keep the stability of the manufacture line, reduce the quality volatility. It can improve the yield and reliability of the devices. First sampling the bonding strength data at the current condition, calculate and analysis the process capability index, provide process adjustis and improvement, till the Cpk ≥ 1.33. Choose the quantity control chart, monitoring the bonding strength value, when finding the process get out of hand, analying the reasons and taking timely corrective and preventive action, ensure process consistency and stability, improve the process yield.
出处
《半导体技术》
CAS
CSCD
北大核心
2009年第8期775-779,共5页
Semiconductor Technology
关键词
统计过程控制技术
键合
工序能力指数
控制图
statistic process control （SPC） technology
wire bonding
process capability index
control chart
