In-Au复合焊料研究

Research on In-Au Composite Solder

大功率半导体激光器封装过程中,为降低封装引入的应力,踊般用In焊料进行焊接。In焊料具有易氧化、易"攀爬"的特性,因而导致封装成品率很低。提出了一种新型焊料——In-Au复合焊料,使用此焊料进行封装,很好地解决了上述问题。通过理论分析及实验摸索,确定了In-Au复合焊料蒸发条件,分别利用纯In焊料和In-Au复合焊料封装了一批激光器样品,通过对比这两组样品的焊料浸润性、电光参数、剪切强度等,发现利用In-Au复合焊料封装的样品优于纯In焊料封装的样品。

To reduce packaging stress, In solder is often used in high power semiconductor laser diode packaging process. But In solder is easy to be oxidized and easy to ＂climb＂, so the product yield is very low. A new solder was introduced, In-Au composite solder, the issue above was solved by this solder. The parameter of vapor was confirmed with the help of theory analyzing and testing. A batch of LD samples were packaged using pure In solder and In-Au composite solder separately, by comparing soldering wetting, electrie-optic parameter, shear intensity etc. It is proved that the sample using In-Au composite solder is preceding than that using pure In solder.