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低成本E_0级地板用UMF胶的研制 被引量:6

Research on UMF Resin for Manufacturing Low Cost E_0 Grade Flooring Board
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摘要 采用碱-酸-碱传统工艺,F/(U+M)摩尔比1.15,三聚氰胺用量13%制得E_0级地板用UMF树脂胶。该胶制备工艺简单,三聚氰胺和尿素分三批添加反应平稳易控制,再现性好,游离甲醛低,贮存期达15d以上。用该胶压制的胶合板,胶合强度符合Ⅱ类板国家标准,甲醛释放量<0.5mg/L,该胶的三聚氰胺用量比市售的地板胶降低2%~5%,成本较低。 The Urea-melamine-formaldehyde (UMF) resin for E0 degree flooring board was synthesized by alkali-acid-alkali traditional process, with 13 % melamine ( base on UMF resin) and the F/( U + M) molar ra- tio being 1.15. The resulted adhesive showed specific properties such as low free formaldehyde, low cost and long reserving time (〉15days). The adhesive production had many characteristics of simple manufacture process,smooth reaction, easy operation and good reproducibility. The formaldehyde emission of the UMF- bonded plywood was less than 0.5mg/L and the bond strength of it could meet the requirement of type ]1 ply- wood (0. 7MPa). The melamine amount used in UMF adhesive production was 2%-5% less than in the mar- ketable UMF adhesive production.
出处 《林产工业》 北大核心 2009年第4期6-10,20,共6页 China Forest Products Industry
基金 浙江省省院合作林业科技项目(2006SY13) 948创新项目(2006-04-C03) 十一五支撑课题(2006BAD18B10)
关键词 胶合板 E0级地板 三聚氰胺改性脲醛树脂 低甲醛释放量 Plywood Eo grade flooring board UMF resin Low formaldehyde emission.
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