摘要
介绍了电子设备热设计的基本内容,阐述了应用热分析软件的设计流程。采用Icepak软件对某密闭电子设备的原始设计进行了热仿真,从结果中找出了关键发热器件和影响散热的薄弱环节。通过调整关键发热器件的散热方式和机箱的整体散热结构,对密闭电子设备的结构进行了优化,使其满足了热设计要求。
Based on the basic knowledge of thermal design of the electronic equipment, this paper explains the process of using heat analysis software. Through using the software of Icepak, a thermal simulation of the original design of the sealed electronic cabinet is made, in which the key weak parts of heating on devices and the causes which affect the cooling are found. Besides, the cooling modes of the key parts of heating and the whole heat dissipation structure are adjusted, so that the structure of the sealed electronic cabinet is optimized, and the demand to thermal design be met.
出处
《电子机械工程》
2009年第4期7-9,53,共4页
Electro-Mechanical Engineering
关键词
密闭机箱
热设计
仿真
优化设计
sealed electronic cabinet
thermal design
simulation
optimization design
