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Noise performance in AlGaN/GaN HEMTs under high drain bias

Noise performance in AlGaN/GaN HEMTs under high drain bias
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摘要 The advent of fully integrated GaN PA-LNA circuits makes it meaningful to investigate the noise performance under high drain bias. However, noise performance of AlGaN/GaN HEMTs under high bias has not received worldwide attention in theoretical studies due to its complicated mechanisms. The noise value is moderately higher and its rate of increase is fast with increasing high voltage. In this paper, several possible mechanisms are proposed to be responsible for it. Impact ionization under high electric field incurs great fluctuation of carrier density, which increases the drain diffusion noise. Besides, higher gate leakage current related shot noise and a more severe self-heating effect are also contributors to the noise increase at high bias. Analysis from macroscopic and microscopic perspectives can help us to design new device structures to improve noise performance of AlGaN/GaN HEMTs under high bias. The advent of fully integrated GaN PA-LNA circuits makes it meaningful to investigate the noise performance under high drain bias. However, noise performance of AlGaN/GaN HEMTs under high bias has not received worldwide attention in theoretical studies due to its complicated mechanisms. The noise value is moderately higher and its rate of increase is fast with increasing high voltage. In this paper, several possible mechanisms are proposed to be responsible for it. Impact ionization under high electric field incurs great fluctuation of carrier density, which increases the drain diffusion noise. Besides, higher gate leakage current related shot noise and a more severe self-heating effect are also contributors to the noise increase at high bias. Analysis from macroscopic and microscopic perspectives can help us to design new device structures to improve noise performance of AlGaN/GaN HEMTs under high bias.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2009年第8期67-70,共4页 半导体学报(英文版)
基金 supported by the State Key Development Program for Basic Research of China (No.2002CB311903) the Key Innovation Program of the Chinese Academy of Sciences (No.KGCX2-SW-107)
关键词 GaN HEMT noise performance high drain bias high electric field impact ionization GaN HEMT noise performance high drain bias high electric field impact ionization
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参考文献13

  • 1Palmour J W, Sheppard S T, Smith R R et al. Wide bandgap semiconductor devices and MMICs for RF power applications. IEDM Tech Dig, Washington D C, 2001:385.
  • 2Mishra U, Likun S, Kazior T, et al. GaN-based RF power devices and amplifiers. Proc IEEE, 2008, 96(2): 287.
  • 3Rudolph M, Behtash R, Hirche K, et al. A highly survivable 3-7 GHz GaN low-noise amplifier. IEEE MTT-S Int Microw Symp Dig, San Francisco, CA, 2006:1899.
  • 4Parikh P, Wu Y, Moore M, et al. High linearity, robust, AlGaNGaN HEMTs for LNA and receiver ICs. Lester Eastman Conf Abstract Book, Newark, 2002:56.
  • 5Quach T, Fitch R C, Gillespie J, et al. Low noise-high power GaN HEMT technology for mixed mode applications. The International Conference on Compound Semiconductor Manufacturing Technology, Florida, 2004.
  • 6Kobayashi K W, Chen Y C, Smorchkova I, et al. 2 watt, subdB noise figure GaN MIC LNA-PA amplifier with multi octavebandwidth from 0.2-8 GHz. EEE IMS Conference, 2007:619.
  • 7Huang F J, Kenneth O. A 0.5-/1m CMOS T/R switch for 900- MHz wireless applications. IEEE J Solid-State Circuits, 2001, 36(3): 486.
  • 8Schuh P, Leberer R, Sledzik H, et al. Linear broadband GaN MMICs for Ku-band applications. IEEE MTT-S Int Microw Syrup Dig, 2006:1324.
  • 9Krausse D, Quay R, Kiefer R, et al. Robust GaN HEMT lownoise amplifier MMICs for X-band applications. Proceedings 12th GaAs Symposium, Amsterdam, 2004:71.
  • 10Kolnik J, Ogzman I H, Brennan K F, et al. Monte Carlo calcuation of electron initiated impact ionization in bulk zincblende and wurtzite GaN. J Appl Phys, 1997, 81: 726.

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