一种低熔点玻璃保护浆料

A low melting point glass paste for protection

研制了一种厚膜片电阻用低熔点玻璃保护浆料。这种浆料由玻璃粉、颜料及有机载体按一定比例混合而成。烧结温度约６００℃，黏度１８０～２４０Ｐａ·ｓ，颗粒度不大于３μｍ，被封电阻烧成后，平均阻值变化率为０．６５％。

A low melting point glass paste for protecting thickfilm resistors is developed It consists of powdered glass, pigment and organic adhesive The sintering temperature is 600℃, viscosity 180～240 Pa·s, particle size less than 3 μm and the average resistance change ratio of the coated resistors 0.65%(4 refs)