摘要
详细地介绍了热压成型工艺设备的结构,使用情况。该设备制作简单、实用。用它烧结的LKNN和KTN材料致密均匀,电阻率较高,热释电系数较大,且介电损耗小。使用情况表明:该设备适用于致密陶瓷的烧结。
Presented is a practical hotpresssintering equipment for functional ceramics, which is easier to make Whit the equipment, compact and homogeneous Li_xK_yNa_zNbO_3 and KTa_[1-x] Nb_xO_3 can be acquired, of which the resistivity is higher, pyroelectric coefficient larger and dielectric loss lower(2 refs)
出处
《电子元件与材料》
CAS
CSCD
1998年第4期37-38,共2页
Electronic Components And Materials