微弧氧化陶瓷表面无钯活化化学镀铜的研究

Electroless copper plating on the micro-arc oxidation film without Pd activation

用氢氟酸活化方法取代传统的钯胶活化法,在镁合金微弧氧化陶瓷膜表面经化学镀铜制备了陶瓷/铜协合膜层。结果表明,铜层连续均匀地覆盖微弧氧化陶瓷层表面,渗入并填充陶瓷层内部呈网状分布的孔隙,实现了铜层与陶瓷层在呈网络状分布的孔隙处产生机械咬合、钉扎或锁扣。以价健理论分析了材料表面析氢电催化活性过程,探讨了微弧氧化陶瓷层表面氢氟酸活化机理。

By hydrofluoric acid activation, a synergistic ceramic/copper coating on micro -arc oxidation film is created with electroless copper plating. Testing results indicate that continuous copper coating is evenly distributed on ceramic coating, while penetrating and filling the reticular pore layer in ceramic coating and realizing a mechanical bonding of the copper layer and the ceramic coating. The catalytic activity of hydrogen evolution reaction on the surface is analyzed and the hydrofluoric acid activation mechanism is studied on the base of valence - bond theory.