Si_3N_4/金属扩散焊接头的残余热应力有限元分析

Residual Thermal Stress FEM Analysis of Si 3N 4/Metal Diffusion Bond Tip

采用弹塑性有限元方法，计算了以纯铝为中间层材料，通过真空热压扩散焊获得的Ｓｉ３Ｎ４／金属接头中的残余热应力分布。接头中Ｓｉ３Ｎ４一侧外表面、特别是四条棱边处具有比其内部高的张应力，在所计算试样中距焊缝０７５ｍｍ处张应力值最大。接头断裂应首先产生在这些位置。

The residual thermal stress distribution of the Si 3N 4/Metal vacuum diffusion bonding tip which uses pure aluminum as interlayer was calculated by the method of elastoplastic FEM. The results show that there is much higher tensile stress on the surface of Si 3N 4 side than that inside, and there is a residual thermal tensile stress peak at the Si 3N 4 side where is 0.75 mm from the bonding interface. The rapture may take place firstly at this site.