摘要
选用四种不同的醚与单一醇复配作为溶剂配制出四种助焊剂。通过扩展试验、润湿力试验和表面绝缘电阻测试,评价各种助焊剂的性能。结果表明,溶剂种类对焊料的平均扩展率、润湿性能和表面绝缘电阻均有影响;沸点与焊料熔点相近的溶剂所配助焊剂使焊料具有75.4%的平均扩展率;对活化剂有最好溶解能力的溶剂可提高润湿速率约12.5%。
In order to study the effect of various solvents on the performances of flux, four kinds of ethers and a certain alcohol were mixed to prepare four different kinds of fluxes. Moreover, the performances of flux were investigated with the tests of expansion, wettability and surface insulation resistance. The results indicate that the solvents types have the effects on the average spread rate, the wettability and the surface insulation resistance. The solvent whose boiling point closes to the solder melting point has the average spread rate of 75.4%. The solvent which has strong dissolving capacity for activator can promote the flux active and increase the wetting rate about 12.5%.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2009年第9期69-72,共4页
Electronic Components And Materials
基金
国家"十一五"计划重点资助项目(No.2006BAE03B02)
2006年度高等学校博士学科点专项科研基金资助项目(No.20060005006)
北京市高校"学术创新团队计划"资助项目
关键词
溶剂
助焊剂
润湿性
表面绝缘电阻
平均扩展率
solvent
flux
wettability
surface insulation resistance
average spread rate
