无色透明耐高温聚酰亚胺膜材料的研究进展

Progress of colorless,transparent and thermal resistant polyimide films

综述了无色透明耐高温聚酰亚胺(PI)膜材料的应用、国内外研究进展和分子结构设计方法。首先,介绍了PI膜材料在微电子及光电产业的应用,以及国内外对无色透明耐高温PI的研究现状。从分析PI有色原因及影响因素入手,阐述了目前制备无色透明PI膜材料的主要分子结构设计方法:引入含氟取代基、主链引入脂环结构、非共平面结构、间位取代二胺、引入砜基等。此外,在使PI无色透明化的同时,为了不牺牲PI优良的耐热性,与适量无机纳米组分复合也是一个可行的设计手段。

The applications, research progress and molecular design of colorless, transparent and thermal resistant polyimide（PI） films were reviewed. Firstly, the applications for the microelectronics and optoelectronics industry and the research progress at home and abroad of colorless, transparent and thermal resistant PI were introduced. Secondly, on the basic of analyzing the causes for PI with color and its factors, the main molecular design methods to prepare the colorless, transparent and thermal resistant PI film were introduced, such as introducing fluorine substituent, alicyclic moieties, non- plane structure, m-diamines, the sulfone moieties into the PI backbone and so on. Furthermore, in order to improve the transparency, at the same time not to sacrifice excellent heat resistance of PI, composing with the appropriate amount of inorganic nano-component was also a feasible design means.