摘要
目前,在硅单晶锭切割领域多线切割机已得到广泛的应用。切割砂浆及切割线在切割中有着极其重要的作用,不同的使用条件会直接影响切割晶片的几何参数。主要讨论切割线直径的不同对切割出晶片几何参数的影响。
At present, the multi-wire saw machine is widely used in cutting silicon material field. The slurry and steel wire take the most important role in the cutting, Different using conditions may affect the geometry parameters of the wafer. And different diameter of the wire may change the quality of the wafer was mainly studied in this article.
出处
《电子工业专用设备》
2009年第8期16-19,共4页
Equipment for Electronic Products Manufacturing
