锗单晶切割工艺研究

A Basic Study in Cutting Monocrystalline Germanium

多线切割机是一种将晶棒切割成晶片的设备,近年来得到大规模使用,其切割原理为利用高速运动的切割钢线将砂浆带入切割区,砂浆中的坚硬颗粒(主要为SiC)与晶棒进行磨削,进而起到切割作用。根据锗材料的特殊性,通过改变工艺参数(主轴平均转速,砂浆流量,砂浆供给方式等)与硅材料成熟切割工艺进行对比实验,进而稳定锗材料的切割工艺。

Multi-wire saw is a kind of machine that can make the silicon ingot into silicon wafer with different thickness. It＇s widely used in recent years because of its high efficience in cutting. The principle of its cutting is that the high moving wire take the slurry to the cutting distract, the harder particle in slurry （SiC）act with the ingot, then the ingot is being cutten. Base on the particular of the germanium material, we studied the process of cutting germanium material compared with the cutting silicon process by changing the process parameter.