期刊文献+

静电放电机理、影响及离子发生器在电子设备静电防护上的应用研究 被引量:2

Research on Ionizer Applying on Electron Equipment for ESD prevention
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摘要 静电放电问题是困扰包括半导体晶圆,液晶面板,太阳能模块的生产和加工等众多电子、光电子行业的顽疾。被动防止静电放电需要在加工材料选择,工艺流程优化,生产环境温湿度控制等众多环节加以严格限制,其过程复杂,管控起来难度较大。主动预防静电放电的最佳方式就是采用在电子、光电子加工设备上安置离子发生器中来和电子、光电子器件上的多余电荷。离子发生器的性能特点,参数设置等对电子、光电子设备的静电放电控制起着至关重要的作用。 ESD (Electro Static Discharge) is a severity factor that affect yield of electron and photoelectron industry, specially in wafer, LCD panel, solar module factories.To prevent Electro Static Discharge, choosing material, optimizing technical process, controlling temperature and humidity in environment should be limited tightly. It's difficult to operate widely for cockamamie and complex sections, the optimal method to prevent ESD actively is affix ionizer instrument in electron and photoelectron equipment. Those ionizer can neutralized redundancy electrons. And the performance and parameter setting of ionizer take the important effect on ESD controlling.
作者 徐涛
出处 《电子工业专用设备》 2009年第8期41-45,共5页 Equipment for Electronic Products Manufacturing
关键词 离子发生设备 静电放电 电子设备 光电子设备 Ionizer Electro Static Discharge Electron Equipment Photoelectron Equipment
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参考文献3

  • 1周锐,李剑峰,李方义,路冬.金刚石线锯的研究现状与进展[J].现代制造工程,2004(6):112-115. 被引量:20
  • 2夏海良.半导体器件制造工艺[M].上海:上海科学技术出版社,1985..
  • 3杨树人,王宗昌半导体材料北京:科学出版社,2003.56-59.

二级参考文献13

  • 1Wei S.High-Resolution Wafer Surface Topology Measurement and Vibration Analysis in Modern Wiresaw Manufacturing:[Ph D Dissertation].State University of New York,2000
  • 2Oishi H,Asakawa K,Matsuzaki J,Ashida A.Development of water-soluble coolant for multi-wire saw slicing of 400mm-diameter silicon.In:14th Annual Meeting of the American Society for Precision Engineering,MONTEREY,CALIFORNIA,1999
  • 3Costantini M A,Caster A M.Decontamination and recovery of abrasive from wafer production.In:12th Annual National Technical Conference of the American-Filtration-and-Separation-Society on Advancing Filtration and Separation Solutions for the Millennium,BOSTON,MASSACHUSETTS,1999
  • 4Nishijima S,Izumi Y,Takeda S,et al.Recycling of abrasives from wasted slurry by superconducting magnetic separation.IEEE Transactions on Applied Superconductivity,2003,1.13(2)
  • 5Suwabe H,Ishikawa K,Kitajima A.A study on slurry actions and slicing characteristics of multi-wire-saw.Proceedings of ASPE,2001(25)
  • 6Ishikawa K,Suwabe H,Itoh S,et al.A basic study on behavior of slurry actions at multi-wire-saw.Proceedings of Advances in Abrasive Technology,2002(V)
  • 7Ishikawa K,Suwabe H,Itoh S.Study on slurry in slicing characteristics at multi-wire-saw.Proceedings of ASPE,2003(30)
  • 8Clark W I,Shih A J,Hardin C W,et al.Fixed abrasive diamond wire machining-part I:process monitoring and wire tension force.International Journal of Machine Tools and Manufacture,2003,43(5)
  • 9Clark W I,Shih A J,Lemaster R L,et al.Fixed abrasive diamond wire machining-part II:experiment design and results.International Journal of Machine Tools and Manufacture,2003,43(5)
  • 10John,Wohlgemuth H,Stephen,et al.PVMaT Improvements in BP Solar Large-Scale PV Module Manufacturing Using Ultra-thin Multicrystalline Silicon Solar Cells.In:NCPV and Solar Program Review Meeting,2003

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