光弹性贴片中用宽条带法分离主应变的研究

Application of Wide Slip Technique of Photoelastic Coating to Dividing Main Strains

在光弹性贴片法中，通常利用剪应力差法和斜射法来分离主应变。对于应变梯度不大的平面可以采用条带法来分离主应变，但其应用性较差。本文研究用宽条带法来分离主应变，使条带法得到了进一步的推广和应用，从而为解决复合材料、陶瓷材料等新型材料的表面应力测定问题提供了一种新的研究方法。

In the photoelastic coating methods, the shear stress difference and slant incident approaches are often used to divide the main strains. Narrow slip technique can be used to divide the main strain for the plane with small strain gradient. But it is very hard to use this way under other conditions. In this paper, a new photoelastic coating method, wide slip technique, is introduced, and how to use this method to divide the main strain is discussed, the surface stress and fracture of advanced materials such as composites and ceramics can be measured by this method.