用气体喷射强化模拟微电子基片对低挥发性液体的传热

Enhanced Heat Transfer from Simulated Microchips to Surrounding Liquid of Low Volatility with Gas Jet Impingement

通过实验研究了利用气体喷射强化微小加热面对低挥发性液体的传热,在较高的气体喷射速度下,加热面驻点处的局部换热系数比自然对流时高12倍,实验揭示了气体喷射速度、热流密度及喷嘴至加热面间距离对传热的非常复杂的影响。此外,还测量了局部换热系数在加热面上的分布,结果表明局部换热系数的最大值并不在驻点而是在它的上面。

Heat transfer from simulated microchips to surrounding liquid of low volatility with gas jet impingement was studied experimentally.Compaired with the free convection data,the heat transfer coefficient at stagnation zone could be 13 times as high as that at high jet velocity.The effects ofjet velocity,heat flux and nozzle-to-plate spacing were inves tigated.The measured heat transfer coefficient distribution showed that the maximum did not appear at stagnation piont but above it.An empirical formular was presented,that may be used for both high and low volatility liquids.