摘要
采用Sn-2·5Ag-2·0Ni焊料钎焊了具有Ni(P)/Ni(B)和Ni(P)/Ni两种双镀层结构的SiCp/Al复合材料.结果表明,SnAgNi/Ni(B)/Ni(P)和SnAgNi/Ni/Ni(P)两种接头均生成唯一的金属间化合物Ni3Sn4.SnAgNi焊料与Ni(B)镀层之间的快速反应速度使Ni3Sn4金属间化合物具有高的生长速度.时效初期的SnAgNi/Ni/Ni(P)接头的剪切强度高于SnAgNi/Ni(B)/Ni(P)接头,但在250h时效后其剪切强度剧烈下降,低于SnAgNi/Ni(B)/Ni(P)接头.金属间化合物的生长及裂纹的形成是SnAgNi/Ni/Ni(P)接头失效的主要原因,而SnAgNi/Ni(B)/Ni(P)接头失效的主要原因是Ni(P)镀层中Ni原子的定向扩散使SiCp/Al复合材料与Ni(P)处产生孔洞.
An experimental study was presented to evaluate the microstructures and reliability of solder joints between Sn-2.5Ag- 2.0Ni solder and various Ni plating layers. Ni（P）/Ni（B） and Ni（P）/Ni double layers were used to deposit on SiCp/Al composites. The high reaction rate between Ni（B） layer and SnAgNi solder leaded to the highest growth rate of intermetallie compound （IMC） Ni3Sn4. The shear strength of solder joints with Ni（P）/Ni layer is higher than that of solder joints with Ni（P）/Ni（B） layer at the initial stage of aging, but lower than that after 250 h aging. [ntermetallie layer growth and crack formation are the major reasons of failure for a SnAgNi/Ni/Ni（P） solder joint. While the failure of a SnAgNi/Ni（B）/Ni（P） solder joint is caused by the formation of holes between Ni（P） and SiCp/Al composites, which result from directional diffusion of Ni toward solder.
出处
《北京科技大学学报》
EI
CAS
CSCD
北大核心
2009年第7期884-889,共6页
Journal of University of Science and Technology Beijing
基金
国家自然科学基金资助项目(No.50274014
No.50774005)
国家重点基础研究发展计划资助项目(No.2006CB605207)
国家高技术研究发展计划资助项目(No.2006AA03Z557)
