摘要
为降低常规化学镀的施镀温度,采用低温超声波化学镀镍工艺,研究了镀波成分、工艺条件的影响。与传统化学镀镍工艺相比,该工艺所得镀层含磷量高、硬度高,组织结构致密均匀。
The purpose of the study was to lower plating temperature of conventional nickel electroless plating process by use of ultrasonic wave. Effect of bath contents and plating parameters on plating rate was emphasized. Properties of the deposits such as morpology, microstructure, phosphorus content and bardness were studies. Compared with conventional electroless nickel plating process, the deposits obtained are greatly improved with higher phosphorus content, hardness, more compact and uniform microstructure.
出处
《电镀与涂饰》
CAS
CSCD
1998年第3期1-4,21,共5页
Electroplating & Finishing
基金
国家自然科学基金!59571049120
关键词
化学镀
超声波
低温
镀镍电镀
工艺
electroless nickel plating, ultrasonic wave, low temperature