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印制电路板应变测量用应变片选用方法研究 被引量:3

Selection Methodology Study of Strain Gages for Printed Circuit Board Strain Measurement
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摘要 应变测量由于它的众多优点在电子产品可靠性领域的应用越来越广泛,但电阻应变片的类型繁多,功能各异,以至于使用者很难找到满足自己测试目的和测试环境的应变片。文章提出的选用方法从应变片种类、敏感栅材料、基底材料、电阻值、尺寸、敏感栅结构型式和测试量境温度等方面,综合考虑并结合生产商的应变片型号编码系统,可以快捷地找到适合的印制电路板应变测量用应变片,同时针对绝大多数电子制造商不具备专业应变片检定设备的现实,介绍了一套简单可行的应变片检定工具,并通过两个实例证明该检定方法的可行性。 Strain measurement because of its many advantages is applied more and more widely in the field of reliability of electronic products, but the type of resistance strain gauges many different features that users find it is difficult to find the strain gauge which can meet their own measurement purposes and measurement environment. In this paper, the choice of method bases on the strain gauge types, sensitive gate materials, substrate materials, resistance value, size, structure-sensitive gate and test temperature and so on throughout the volume considered i.n combination with strain gauge manufacturers strain gauge number coding system can quickly find a suitable printed circuit board strain measurement with strain gauge, while for the vast majority of electronics manufacturers do not have the professional equipment for strain gauge test reality, to introduce a set of simple and practical calibration tool for strain gauge, and through two examples to prove that the calibration method feasibility.
出处 《印制电路信息》 2009年第9期30-35,共6页 Printed Circuit Information
关键词 电阻应变片 印制电路板 型号编码系统 检定方法 resistance strain gage Printed Circuit Board model number coding system calibration method
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参考文献17

  • 1A.L.Window,G.S.Holister.朱鼎铭等译.应变计技术[M].中国计量出版社,1989.
  • 2STRAINGAUGES.KYOWAELECTRONIC INSTRUMENTS CO,LTD,2008.
  • 3Swain Gages and Accessories.Hottinger Baldwin Messteclmik Gmb,1984.
  • 4Strain Gage Selection.VISHAY,2000.
  • 5Strain Gage Measurements on Plastics and Composites.VISHAY,2001.
  • 6IPC-T-50 Terms and Defmitions for Interconnecting and Packaging Electronic Circuits.IPC,2003.
  • 7IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies.IPC,1996.
  • 8IPC-7095.Design and Assembly Process Implementation for BGAs.IPC.2000.
  • 9IPC-9701.Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachements.IPC,2002.
  • 10IPC/JEDEC-9702 Monotonic Bend Characterization ofBoard-Level Interconnects,IPC/JEDEC,2004.

同被引文献21

  • 1周文静,彭娇,于瀛洁.基于数字全息技术的变形测量[J].光学精密工程,2005,13(z1):46-51. 被引量:22
  • 2徐莹,赵建林,范琦,向强.利用数字全息干涉术测定材料的泊松比[J].中国激光,2005,32(6):787-790. 被引量:18
  • 3曲伟娟,刘德安,职亚楠,栾竹,刘立人.利用数字全息干涉术观察RuO_2:LiNbO_3晶体中畴反转的区域特性[J].物理学报,2006,55(8):4276-4281. 被引量:7
  • 4杨国光.近代光学测试技术[M].浙江:浙江大学出版社,2002..
  • 5CUCHE E, MARQUET P, DEPEURSING C. Digital holography for quantitative phase-contrast imaging [J]. Opt. Lett. , 1999, 24(5) :291-293.
  • 6SUN W W, ZHAO J L, DI J L, et al.. Real-time visualization of Karman vortex street in water flow field by using digital holography[J]. Opt. Express, 2009,17(22) : 20342-20348.
  • 7WAHBA H, KREIS T. Characterization of graded index optical fibers by digital holographic interfer- ometry [J]. Appl. Opt, 2009,48(8) :1573-1582.
  • 8SEEBACHER S, OSTEN W, JUPTNER W. Measur- ing shape and Deformation of small objects using digital holography [C]. SPIE, 1998,3479 : 104-115.
  • 9YAMAGUCHI I, KATO J, MATSUZAKI H. Measurement of surface shape and deformation by phase-shifting image digital holography [J]. Opt. Eng, 2003,42 :1267-1271.
  • 10QUAN C, TAY C J, CHEN W. Determination of displacement derivative in digital holographic inter- ferometry [J]. Opt. Commun, 2009,282(5):809- 815.

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