摘要
无铅化工艺会对互连可靠性带来冲击,无铅化装配和返修会使工艺窗口变窄,对PCB组件来说以往可以最低程度接受的现象,现在成为了缺陷。无铅化组装要求在铜、基础材料和设计之间进行均衡,以确保可靠性。
Lead-free Processing will be impact on Interconnect Reliability. Lead-free assembly and rework have narrowed the process window, and PCBs that would have been marginally acceptable before are now failing. Lead-free assembly requires a balance between copper, base material and design to assure reliability.
出处
《印制电路信息》
2009年第9期67-70,共4页
Printed Circuit Information
关键词
无铅化
印制电路板
互连
可靠性
电子组装
lead-free
Printed Circuit Boards
interconnect
reliability
electronic packaging
