摘要
研究了在真空条件下采用Ag-Ti4活性钎料对AlN陶瓷与W-Cu合金的活性钎焊。试验获得了性能良好的AlN陶瓷与W-Cu合金的焊接组件,力学性能测试发现,剪切强度可达114.9 MPa,试样断裂发生在AlN陶瓷一侧。通过SEM,EDX方法分析了焊接层的显微结构和元素分布,分析了连接强度较高的原因。通过XRD分析方法测定了焊接的冶金结合及新相的生成。
AIN ceramic and W-Cu alloy had been brazed using Ag-Ti4 active filler metal in the vacuum condition. The results indicated that Ag-Ti4 active filler metal can join AlN with W-Cu alloy directly. The bonding strength was measured, the shearing strength can reach to 114.9 MPa, and the fracture took place in the side of AlN ceramics. The microstructure and phases of bonding area were analyzed by SEM, EDX and XRD. The results are very useful to the broad application of these two materials in the microelectronics field.
出处
《真空电子技术》
2009年第4期32-35,共4页
Vacuum Electronics
基金
国家973项目(2006CB605207)
