厚复合夹层胶接采用先期真空预制方法的研究

Study of Preformed“B”grade Super-Thickness Composite between Coppers for Bonding

ＨＴ－Ｕ托卡马克装置的１∶２模拟纵场线圈是由１４块１５３０ｍｍ×１５００ｍｍ×７ｍｍ的大块铜板进行胶接而成的。设计粘接层厚度为１５ｍｍ的玻璃纤维复合材料，厚度精度±０１ｍｍ，剪切强度大于３０ＭＰａ，耐交流电压１５００Ｖ／１ｍｉｎ。经试验采用１３层０１４ｍｍ、含胶量３０％～３５％（重量）载胶玻璃布，真空条件下先期预制成１６ｍｍ厚左右的“Ｂ”状态复合材料，然后放入两块７ｍｍ厚的铜板之间，叠合所有铜板加压固化。结果表明厚度均匀性小于３％，剪切强度大于设计要求。

Befor manfacturing the HT-tokamk TF[toridal field]coil,a simulated 1∶2 TF coil,which was consisted of 14 pieces,1530×1500×7mm coppers and 15 mm thickness composite between coppers,has been developed.The composites were designed with±01 mm precision in thick,200kg/cm2 shear strength,1500V/1 min AC resistant voltage.After lots of trials,it is determined that the preformed“B”grade composite,which were made up of 13 pieces,014 mm in thickness impregnated-glue fiber glass,formed in vacuum,was used.The“B”grade composite was 16 mm thickness.Finally,the uniformity of composites,after the TF coil cured,was less than 3%,and the shear strength was greater than the designment.