波峰焊焊点有限元模型的建立与分析

Establishment and Analysis of Wave Soldering Solder Joints Finite Element Model

焊点在热循环服役条件下的力学行为分析是研究互连焊点失效机制的可行手段。采用MSC.MARC2000/MENTAT2000建立波峰焊焊点可靠性分析有限元模型,利用有限元计算软件Surface Evolver来对模型进行求解,研究三维空间中由重力、表面张力和其它形式的外力作用下的液体表面的成型问题。通过对典型插装元器件波峰焊焊点建立有限元分析的力学模型和在热循环载荷下应力应变过程,分析焊点内部力学参量和应力场的分布特征,结合通孔波峰焊点的热冲击可靠性测试结果,以此研究焊点失效机制。

Analysis of solder joints mechanical behavior under thermal cycle service is a feasible means to research solder joints failure mechanism. Develop wave soldering solder joint reliability finite element model with MSC. MARC2000/MENTAT2000 and solve it with suface evolver software, research the forming of the liquide surface in three - dimensional space which influenced by gravity, surface tension and other exogenic actions. Study failure mechanism of solder joints based on experiment result of wave soldering solder joints reliability under the thermal shock and analysis of solder joints inner mechanics parameters and its stress field distributing characteristic by the means of building up the finite element mechanical model and stress - strain process under theraml cycle of typical through hole components wave soldering solder joint.