摘要
晶须特别是锡须问题已成为印制板无铅焊接质量可靠性的核心问题之一。从研究外应力型、内应力型以及焊接过程中热循环等产生晶须的主要因素出发,分析了不同条件下晶须的产生机理,并给出了如何有效抑制晶须产生的措施。最后扼要指出了晶须研究的今后研究方向。
Tin whisker is presented as a key problem for reliabiligy of PCB lead - free soldering. The tin whiskers caused by mechanical stress, interal stress and thermals cycle of soldering process are studied. The mitigation technology of whiskers are discussed based on the amalysis of the reason and the condition of whisker forming. The study direction of whisker forming is indicated.
出处
《电子工艺技术》
2009年第5期282-286,共5页
Electronics Process Technology
