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考虑热电耦合效应的缓冲器插入功耗优化

Power Optimization by Repeater Insertion with Thermal-Electric Coupling Effects
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摘要 为了改善芯片的功耗和温度特性,提出了一种缓冲器插入功耗优化方法.该方法基于延时、功耗和温度三者之间的热电耦合效应,给出了相应的延时、功耗和热模型;通过在允许的范围内牺牲部分延时来优化功耗,并在优化过程兼顾温度对延时和功耗的影响以及互连电感效应对延时的影响,利用Matlab软件求得最佳优化结果.采用该方法针对65nm和45nm工艺节点的缓冲器插入进行分析和验证的结果表明了其有效性.文中同时指出忽略互连电感效应会低估芯片的优化稳态功耗和温度. To improve the power and temperature characteristics of IC, a power optimization method by repeater insertion is presented in this paper. It is based on the electro-thermal coupling among power, delay and temperature, includes delay model, power model and thermal model, and makes power consumption reduced by allowing a small delay penalty. The proposed method contains temperature impacts on delay and power, and takes inductance effect into consideration. The optimized results are gained by using Matlab software. Simulations for repeater insertion under 65 nm and 45 nm technology are carried out and the results show that the chip temperature and power optimized by the proposed method are decreased dramatically. In addition, this paper points out that absence of inductance effect leads to underestimate optimal temperature and power.
作者 冷鹏 董刚 柴常春 杨银堂
机构地区 西安电子科技大学微电子所宽禁带半导体材料与器件教育部重点实验室
出处 《计算机辅助设计与图形学学报》 EI CSCD 北大核心 2009年第9期1264-1269,共6页 Journal of Computer-Aided Design & Computer Graphics
基金 国家自然科学基金(60606006) 国家杰出青年科学基金(60725415) 重点实验室基金(9140C030102060C0303)
关键词 延时 功耗 缓冲器插入 热电耦合 电感 delay power repeater insertion thermal-electric coupling inductance
分类号 TN405.97 [电子电信—微电子学与固体电子学]
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参考文献21

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计算机辅助设计与图形学学报
2009年 第9期

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