微流体技术在电子芯片冷却中的应用研究进展

Application prospects of microfluidics technology in electronic chip cooling research

随着微电子技术向小型化集成化及高频高速方向发展,计算机芯片集成度的提高受到因电子元器件发热而引起的热障所限制,芯片冷却问题成为影响计算机进一步发展的关键因素之一。介绍了电子芯片发展的现状及主要冷却方法的发展,从冷却驱动器件、微通道结构各个角度论述了微流体技术在电子芯片冷却中的重要作用,重点介绍了微槽道冷却和微喷冷却的微流体技术特征,论述了压电泵、电渗、热管等微流体驱动技术在冷却液驱动的应用。

Electron heat releasing becomes the bottleneck of micro electronic industrial development with the ministurizod integration, high frequency and high speed of the electronic technologies. Improvement on the computer chip integration has to face the restriction from the thermal barrier caused by the heat generation within the electronic elements. Chip cooling is one of the key factors for computer development.. The development status cooling methods of the electronic chip is introduced. Applications of Microfluidics technology in electronic chip cooling is discussed on different angles of cooling driven devices and micro channel structure. The features of micro jet and micro channel cooling is introduced, the piezoelectric pump, electroosmosis, such as heat pipe technology in micro fluid drive is discussed.