摘要
采用Anand模型描述钎料本构关系,对温度循环载荷下两种不同阵列形式的塑料球栅阵列(PBGA)Sn3.0Ag0.5Cu焊点的应力应变响应进行有限元分析.结果表明,两种不同阵列条件下,关键焊点的位置均由芯片拐角位置决定.芯片尺寸改变时,PB-GA121焊点的最大应力值随芯片尺寸的增大而增大,但PBGA81的最大应力值随芯片尺寸增大先减小后增大.凭借Engelmaier修正的Coffin-Manson寿命预测方程,分别预测了两种不同阵列PBGA器件四种芯片尺寸条件下焊点的热疲劳寿命,结果表明芯片尺寸对焊点疲劳寿命有较大影响.
Finite element analysis was used to investigate the stress distribution of PBGA soldered joints with different arrangement models,and the constitutive relationship of Sn3.0Ag0.5Cu lead-free solder was described by Anand model.The results indicate that the positions of critical soldered joints are determined by the chip corner.The maximum stress of PBGA121 soldered joints increases when chip size increases,while the maximum stress of PBGA81 soldered joints decreases first and then increases.Based on the modified Manson-Coffin model by Engelmaier,the fatigue lives of critical soldered joints conditions corresponding to four different chip sizes were predicted,and it is found that the size of Silicon chip has a significant effect on the fatigue life of soldered joints.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2009年第9期73-76,共4页
Transactions of The China Welding Institution
基金
2009年南京航空航天大学博士学位论文创新与创优基金资助项目(BCXJ09-07)
2006年江苏省"六大人才高峰"基金资助项目(06-E-020)
江苏省普通高校研究生科技创新计划基金资助项目(CX07B-087z)
关键词
塑料球栅阵列
阵列形式
芯片尺寸
疲劳寿命
plastic ball grid array
arrangement model
chip size
fatigue life
