摘要
介绍了焊膏的成分、流变特性、黏度、合金粉末的尺寸与均匀性等,分析了模板与印刷工艺因素对焊膏印刷适性的影响,并提出印刷适性的检测方法和工艺改善方法。
The article introduces the solder paste ingredients, theological property, vis- cosity and the particle size and uniformity of the alloy powder used. It analyses the influence of the stencil and printing process factors onto the printability, and recommends the methods for the printability test and process improvements.
出处
《丝网印刷》
2009年第9期17-20,共4页
Screen Printing
