脉冲化学镀与化学镀非晶态 Ni-P 合金镀层的微观结构

Microstructures of Amorphous Ni-P Alloys Prepared by Impulse Electroless and Electroless Plating

利用Ｘ射线衍射（ＸＲＤ）及热分析（ＤＴＡ）技术，研究了脉冲化学镀与化学镀非晶态Ｎｉ－Ｐ合金的原子分布函数及晶化过程，得出了两种非晶态合金的微观结构信息（平均原子间距，相应配位原子数和短程有序畴）及各特征温度的晶化激活能。结果表明：脉冲化学镀非晶态Ｎｉ－Ｐ合金的短程有序畴比化学镀的小０．１ｎｍ左右；其晶化初期的激活能比化学镀的高大约２６ｋＪ／ｍｏｌ；与熔体激冷法相比，脉冲化学镀及化学镀所得非晶态Ｎｉ－Ｐ合金的短程有序畴小约一半，且晶化激活能低；最后提出了脉冲化学镀及化学镀非晶态合金的沉积机制。

By means of XRD and DTA, were studied the atomic distribution functions and crystallization process of amorphous Ni-P alloys prepared by impulse electroless and electroless plating.Knowledge of the microstructure,such as average atom distance and the scale of short range order,and the values of activation energy for crystallization at each characteristic temperature were obtained.The results show that the scale of short range order of impulse electroless is less and the starting activation is higher than that of electroless for about 0.1 nm and 26 kJ/mol.Compared with amorphous Ni P alloys prepared by rapid quenching ,The scales of short range order of impulse electroless and electroless of amorphous alloys prepared by impulse electroless and electroless plating is put forward.