摘要
焊点形态参数直接影响ＳＭＴ焊点的可靠性。为了建立ＰＢＧＡ焊点形态参数与热疲劳寿命的关系，利用ＢＧＡ焊点成形软件得到焊点形态，采用ＰＢＧＡ阵列数学分析与关键焊点非线性有限元分析相结合的方法得到关键焊点内的最大总应变值，利用热疲劳寿命计算公式得到焊点的热疲劳寿命。通过分析和数据处理得到ＰＢＧＡ焊点形态参数与热疲劳寿命之间的关系曲线，并总结出焊点形态参数对热疲劳寿命的影响规律及它们的关系表达式。
The evolving parameters of SMT solder joint is directly related with the reliability of the solder joint.To evaluate the effect of evolving technical parameters on thermal fatigue life,BGA solder joint profile is first derived,based on the evolving analysis software.The total maximal strain in the key joint is evaluated by the analysis of the value of thermal displacement of PBGA on the key joint and nonlinear finite element analysis on the key joint.Finally,the fatigue life is predicted.The processing and the rules are summarized.
出处
《桂林电子工业学院学报》
1998年第3期44-48,共5页
Journal of Guilin Institute of Electronic Technology
基金
电科院预研基金
关键词
PBGA焊点形态
形态参数
热疲劳寿命
有限元分析
PBGA solder joint,evolving technical parameters,the thermal fatigue life,finite element analysis
